Adhesives

Ceramics adhesive processing

Convential adhesive bonding can be used to produce joints between ceramics and themselves or metals. For relatively low temperatures, (<300°C), organic adhesives will suffice; however, for high temperature capabilities (>1000°C ), inorganic adhesives are required.

The bonds are produced by careful preparation of the substrate surfaces and then the adhesive layer is applied. The whole assembly is then cured, which can require temperatures from 260-1000°C.

The inorganic adhesives are generally composed of constituents such as: alumina, zirconia, silica, magnesia, phosphates and silicates. The ingredients are mixed in order that a range of thermal expansions or operating temperatures may be achieved. Consideration must be taken into account regarding joint design.

It is frequently found that the bondline is fractious; with modest strength. But a bond is retained to high tempreatures (upto 12-1400°C).

Further information

Best practice guides
Joining ceramics - a guide to best practice

Knowledge summaries
Ceramic Adhesives

FAQs
What are ceramic adhesives?
What are inorganic ceramic adhesives?

Staff papers
Techniques for bonding ceramics (Bulletin, September/October 1990) Industrial Members Only

mailto For more information please contact: ceramics@twi.co.uk

Copyright © 2008 TWI Ltd
Information and advice from TWI and its partners are provided in good faith and based, where appropriate, on the best engineering knowledge available at the time and incorporated into TWI's website in accordance with TWI's ISO 9001:2000 accredited status. No warranty expressed or implied is given regarding the results or effects of applying information or advice obtained from the website, nor is any responsibility accepted for any consequential loss or damage.