Technology file

Soldering expertise

TWI's Microtechnology section has developed expertise in all aspects of soldering technology, including:

solder joint design
selection of soldering materials, including alloys and fluxes
process set-up and optimisation, including jigging, heating method, atmosphere and thermal profiling for reflow, wave and hand soldering
inspection and quality
reliability and failure analysis, including accelerated testing and solderability measurement
tailored training courses to meet client specifications
finite element modelling and virtual qualification
advice on legislation compliance and lead-free soldering

Solderability testing: wetting balance in action

Resource

TWI has a range of soldering assembly equipment including convection, infra-red, laser, thermodes, irons and dipping pots. A reliability suite offers thermal cycling, thermal shock, damp heat and salt spray testing, and components and substrates can be assessed with a wetting balance. Sample analysis using, for example, our electron microscope can be carried out to look at joint microstructures or fracture surfaces, and TWI's modelling capability can be utilised to improve assembly design or predict failure modes.

All TWI's confidential consultancy and project work is conducted to ISO 9001 quality standard

For further information, please mail to micro@twi.co.uk.